Reactive Viscosity model
The reactive viscosity model describes the temperature, shear rate, and cure dependance of thermoset materials. This model can be used in the following analysis:
- Reactive Molding
- Microchip Encapsulation
- Underfill Encapsulation
The following equation is used for determining the viscosity of these materials:
where:
is the viscosity (Pa. sec.)
is the shear rate (1/sec.)
is the temperature (deg K)
is the degree of cure (0 - 1)
, 
, 
, 
, 
, 
, 
, 
, and 
(gelation conversion) are data-fitted coefficients.