Include gradual release of build from buildplate in simulation results
*SBDR i1
i1: i*4: removal direction. 0 for +X, 1 for +Y
*SBDR enables cutting away the substrate gradually after the printing process, over the course of four simulation time steps. This feature models electrical discharge machining (EDM) or similar methods of removing parts and supports from the substrate. Cutting is performed in the positive x or y directions. For example, with i1 = 0, in the first cutting step, 25 % of the substrate on the −X end is deactivated using quiet elements. On the second cutting step, 50 % of the substrate is removed. On the third cutting step, all but 25 % of the substrate from the +X end is deactivated.