Tutorial: Electronics
In this tutorial, we simulate the flow and heat transfer within an electronics enclosure. This system contains several components, and we model them with Autodesk® CFD material device models such as Compact Thermal Models, Internal Fans, and Distributed Resistance (porous media).
The solid geometry was created in a CAD system. We will create the air volume using the Void Fill geometry tool in Autodesk® CFD.
We will use groups to simplify the process of assigning settings to multiple parts.
Forced convection is the principal mode of heat transfer.
Key Topics
- Three dimensional assembly
- Incompressible, turbulent, steady state flow
- Automatic Flow Volume creation
- Creation and use of Groups
- Total heat generation boundary condition
- Conjugate and convection heat transfer
- Representing chips with a Compact Thermal Model material
- Modeling printed circuit boards with the PCB Calculator
- Internal Fans and Resistance materials
- Results visualization with cut planes and iso surfaces
- Summary Parts to assess critical values
Goals
- Study the flow and temperature distributions across the system
- Determine the temperature on critical components using Results parts