The Deflection, in-plane (wire sweep) result displays the predicted X-Y (in-plane) deformation of the wire resulting from the encapsulation process.
This result is generated by a Microchip Encapsulation analysis where the wire sweep calculation was performed in Autodesk Simulation Moldflow Insight.
X-rays of actual wire displacement are normally measured in the plane. This result is therefore particularly useful for comparing the simulated results with experimental results.