Microchip Encapsulation analysis results

This help topic provides an overview of the results generated by a Microchip Encapsulation analysis.

Text based results

The following table lists the text results generated for a Microchip Encapsulation analysis.

Graphical results

The following table lists the graphical results that are created by a Microchip Encapsulation analysis and indicates whether each result is supported for the following analysis technologies:
  • Midplane
  • Dual Domain
  • 3D

A Microchip Encapsulation analysis generates the filling, curing, and stress results listed in the table below. For more information about a result, including how to interpret the display, click on the result name.

Note: The Microchip Encapsulation results generated will depend on the mesh type, and the wire sweep/paddle shift related solver parameters that you set. Using the advanced solver settings in the Process Settings Wizard, you can select a small deflection or large deflection Stress analysis, and you can select whether the wire sweep/paddle shift simulation should be performed by Autodesk Simulation Moldflow Insight Stress or Abaqus.
Tip: To display results of a 3D Wire Sweep analysis effectively, it is important to enable the results visualization option to Display 1D elements as segments. If this option is not enabled, result display could be very slow, especially on models that contain many wires.

Click Application menu, then click Options > Results tab and in the Optimize memory for results display area, click in the Display 1D elements as segments checkbox to enable this option.

Flow (Fill+Pack / filling and curing phase) results Analysis technology
Fill time Midplane Dual Domain 3D
Clamp force Midplane Dual Domain 3D
Pressure Midplane Dual Domain 3D
Flow rate, beams Midplane Dual Domain 3D
Average velocity Midplane Dual Domain
Orientation at core Midplane Dual Domain
Orientation at skin Midplane Dual Domain
Shear rate, bulk Midplane Dual Domain
Shear stress at wall Midplane Dual Domain
Bulk conversion at end of process 1 Midplane Dual Domain
Bulk temperature at end of fill Midplane Dual Domain
Bulk temperature, nodal 1 Midplane Dual Domain
Cured layer fraction 1 Midplane Dual Domain
Pressure at end of fill 1 Midplane Dual Domain
Air traps 2 Midplane Dual Domain 3D
Pressure at injection location 2 Midplane Dual Domain 3D
Pressure at V/P switchover 2 Midplane Dual Domain 3D
Temperature at flow front 2 Midplane Dual Domain 3D
Volumetric shrinkage 2 Midplane Dual Domain
Volumetric shrinkage (3D) 3D
% Shot weight 2 Midplane Dual Domain
Bulk conversion 2 Midplane Dual Domain
Bulk temperature 2 Midplane Dual Domain
Frozen layer fraction 2 Midplane Dual Domain
Grow from 2 Midplane Dual Domain 3D
In-cavity residual stress in first principal direction 2 Midplane Dual Domain
In-cavity residual stress in second principal direction 2 Midplane Dual Domain
Sink index 2 Midplane Dual Domain
Throughput 2 Midplane Dual Domain
Volumetric shrinkage at ejection 2 Midplane Dual Domain
Weld lines 2 Midplane Dual Domain 3D
Weld and meld lines 2 Midplane Dual Domain 3D
Air traps, including air vents 3 3D
Conversion at node 3D
Density 3D
Extension rate 3D
Polymer filled region 3D
Shear rate result (3D) 3D
Shear rate, maximum result 3D
Temperature result (3D) 3D
Unfilled cavity 4 3D
Velocity (3D) 3D
Vent region pressure 3 3D
Viscosity 3D
Pressure difference, maximum (paddle shift) 5 3D
Volume change (Runner balance) Midplane Dual Domain
Fiber Orientation analysis results 1 3D
Stress / Wire Sweep & Paddle Shift results Analysis technology
Deflection Midplane Dual Domain 3D
First principal stress (wire sweep/paddle shift) Midplane Dual Domain
Second principal stress (wire sweep/paddle shift) Midplane Dual Domain
Max shear stress (wire sweep/paddle shift) Midplane Dual Domain
Wire-sweep index 6 Midplane Dual Domain 3D
Deflection, in-plane (wire sweep) 6 Midplane Dual Domain 3D
XY deflection (wire sweep) 5 Midplane
Wire number result 7 3D
Maximum wire deflection magnitude - Wire number: XY Plot result 7 3D
Maximum wire sweep index - Wire number: XY Plot result 7 3D
Wire pairs within critical clearance result 7 3D
Distance to closest wire result 7 3D
Stress in first principal direction (stress) 3D
Stress in second principal direction (stress) 3D
Maximum shear stress (stress) 3D
Stress, Mises-Hencky (stress) 3D
Warp results Analysis technology
Deflection, all effects 2 Midplane Dual Domain 3D
Note: The Microchip Encapsulation filling and curing and warp results are the same as for Reactive Molding.
1 For Midplane and Dual Domain analysis technologies, these results are produced only when you have selected an analysis sequence that includes the Incompressible solver.
2 For Midplane and Dual Domain analysis technologies, these results are produced only when you have selected an analysis sequence that includes the Compressible solver.
3 This result is available only when the option to Perform venting analysis is selected in the solver parameters.
4 This result is only available if a short shot occurs during the analysis.
5 This result is only shown when Abaqus is used for the analysis
6 In order to calculate this result, the wire sweep calculation must be performed in Autodesk Simulation Moldflow Insight.
7 In order to calculate this result, the analysis sequence must include Wire Sweep, and the wire sweep calculation must be performed in Autodesk Simulation Moldflow Insight.
1 If you select a material with fiber or filler content, Fiber orientation analysis results also will be generated for a Fill+Pack analysis sequence. The option to perform Fiber orientation analysis if fiber material is enabled by default in the Process Settings Wizard.