This help topic provides an overview of the results generated by a Microchip Encapsulation analysis.
The following table lists the text results generated for a Microchip Encapsulation analysis.
A Microchip Encapsulation analysis generates the filling, curing, and stress results listed in the table below. For more information about a result, including how to interpret the display, click on the result name.
Click Optimize memory for results display area, click in the Display 1D elements as segments checkbox to enable this option.
, then click and in the1 | For Midplane and Dual Domain analysis technologies, these results are produced only when you have selected an analysis sequence that includes the Incompressible solver. |
2 | For Midplane and Dual Domain analysis technologies, these results are produced only when you have selected an analysis sequence that includes the Compressible solver. |
3 | This result is available only when the option to Perform venting analysis is selected in the solver parameters. |
4 | This result is only available if a short shot occurs during the analysis. |
5 | This result is only shown when Abaqus is used for the analysis |
6 | In order to calculate this result, the wire sweep calculation must be performed in Autodesk Simulation Moldflow Insight. |
7 | In order to calculate this result, the analysis sequence must include Wire Sweep, and the wire sweep calculation must be performed in Autodesk Simulation Moldflow Insight. |