Wire-sweep index result

The Wire-sweep index result is a representation of the force created by the flow of plastic past the wires of an integrated circuit.

The Wire-sweep index result is generated by a Microchip Encapsulation analysis.

A wire-sweep index is calculated and plotted for each wire, as follows:

• The analysis finds the point on the wire where displacement in the planar direction is greatest.
  Note: With Dual Domain analysis technology, the point that has the maximum displacement of the whole wire is used. With 3D analysis technology, nodes in each segment that have the maximum displacement in that segment are used.
• It divides this maximum displacement by the length of the wire.
• The result is the wire-sweep index for the individual wire.

Note: In order to calculate the Wire sweep index result, the wire sweep calculation must be performed in Autodesk Simulation Moldflow Insight.