The Distance to closest wire result shows, for each wire, the distance to the nearest other wire in the model.
The Distance to closest wire result is generated by a 3D Microchip Encapsulation analysis when the selected analysis sequence includes Wire Sweep.
The plot shows the location of individual wires with the distance to the closest other wire, after wire deformation has occurred during cavity filling.
Ideally, wire spacing should be uniform. Use this information to identify wires that are too close or too far from adjacent wires.