Underfill encapsulation analysis log

The Underfill encapsulation analysis log is a text report that lists the inputs that you used for the analysis, including solver parameters, material data, process settings and model details, followed by the analysis progress tables.

There is a separate table for the filling phase, and for the curing phase of the analysis.

This text report generated by the Underfill Encapsulation analysis.

Using the analysis log

The analysis log for an Underfill Encapsulation analysis can be used to determine whether the part filled completely during injection before the curing phase began.

Look at the analysis progress table for the injection phase and check whether 100% of the cavity volume filled. If this did not occur, then you may see a message stating that the maximum machine injection pressure was reached and a short shot occurred.

Things to look for

Short shot
If this problem occurs, try changing the following process settings.
  1. Initial encapsulant temperature,
  2. Substrate temperature.
Note: Adjustments such as those above can only be made using a licensed Autodesk Simulation Moldflow Adviser or Autodesk Simulation Moldflow Insight product.
Parent topic: Underfill Encapsulation analysis results