It is now possible to edit solver parameters related to large deflection stress analysis when this stress analysis type is selected to perform the wire sweep calculations in a 3D Microchip Encapsulation analysis.
Previously, while the large deflection stress analysis type option was available for Microchip Encapsulation analyses using 3D and Midplane analysis technologies, the ability to access and edit the large deflection solver parameters was available only for Midplane analysis technology.
The Large Deflection Analysis Solver Parameters dialog is accessed from the Microchip Options tab of the Reactive molding solver parameters (3D) dialog when the Stress analysis type option is set to Large deflection.