The processing conditions listed will depend on the molding process and analaysis sequence selected. The following table lists processing conditions you can expect to find in the DOE builder, given certain selections of analysis sequence and molding process.
| Cool | Fill | Fill+ Pack | Cool+ Fill+ Pack | Over-molding | Injection comp-ression | Reactive molding (incomp-ressible) | Reactive molding (comp-ressible) | Reactive comp-ression molding | Micro-cellular injection molding | RTM/SRIM | Underfill encapsu-lation | Multi-barrel | |
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| Mold surface temperature |
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| Melt temperature |
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| Mold open time |
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| Injection+Packing+Cooling Time |
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| Filling Control |
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| Velocity/pressure switch-over |
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| Pack/Holding control |
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| Cooling time |
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| Compression settings profile |
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| Press open distance |
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| Press waiting time |
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| Press compression time |
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| Press compression force cap |
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| Press compression speed vs distance |
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| Nominal injection time |
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| Melt initial conversion |
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| Curing time |
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| Volume filled at start of foaming |
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| Initial bubble radius |
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| Number of cells per volume |
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| Initial gas concentration |
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| % Ram speed vs % stroke profile |
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| Initial encapsulant temperature |
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| Initial encapsulant conversion |
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| Substrate temperature |
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| Curing temperature |
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