Define the Material Properties

For the steady-state heat transfer analysis, only the thermal conductivity was needed.  For a transient heat transfer analysis, the mass density and specific heat are also required. These properties are already defined for chip (Part 2), which is Silicon, Si (from the Autodesk Simulation Material Library). Here, we define the additional properties for the board and edge connectors.

1. Double-click the Material heading for Part 1 in the browser (tree view).
   1. Click Edit Properties.
      1. Type 2.39e-4 in the Mass density field.
      2. Type 86900 in the Specific heat field.
      3. Click OK to accept these properties.
   2. Click OK to exit the Element Material Selection dialog box.
2. Select the Material heading under Part 3 in the browser.
   • Hold down the Ctrl key and also select the Material headings for Part 4, Part 5, and Part 6. Four Material headings should now be selected.
3. Right-click one of the selected headings and choose Edit Material.
   1. Click Edit Properties.
      • Type 2.22e-4 in the Mass density field.
      • Type 91300 in the Specific heat field.
      • Click OK to accept these properties.
   2. Click OK to exit the Element Material Selection dialog box.

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