The Stress, Mises-Hencky result shows the Mises-Hencky stress (maximum normal stress) in the part (Warp or Stress analysis), or in the wire or paddle (Microchip Encapsulation analysis), at the selected layer through the cross-section, in the deformed state after ejection has occurred.
Mesh type:
Midplane
Note: This result is only available if you have selected an appropriate option in the Stress result(s) to output drop-down menu in the Process Settings Wizard. The result is in the laminate through the thickness of the part shown by the Normalized Thickness value in the legend, and the load factor shown in the legend. Note that the Normalized Thickness value where -1 is the bottom of the element, 0 is the centerline through the element, and +1 is the top of the element.
3D
Note: This result is only available if you have selected the Uncorrected residual stress option in the Process Setting Wizard. The result is an elemental value.
Analysis sequences that include:
- Fill+Pack+Warp
- Cool+Fill+Pack+Warp
Using this result
Use this result when the material is ductile. Consider the areas with a high level of stress and compare the results against the relevant material criteria.
Note: Due to the extrapolation from elemental centroids to the edges of elements, it is possible for small negative values to be generated for this result (Mises-Hencky stress values must, by definition, be positive). These small negative values should be taken to equal zero.
Things to look for
- Always use the maximum value of stress (either top or bottom) when checking to see if the part will fail.