Tutorial: Electronics

In this tutorial, we simulate the flow and heat transfer within an electronics enclosure. This system contains several components, and we model them with Autodesk® CFD material device models such as Compact Thermal Models, Internal Fans, and Distributed Resistance (porous media).

The solid geometry was created in a CAD system. We will create the air volume using the Void Fill geometry tool in Autodesk® CFD.

We will use groups to simplify the process of assigning settings to multiple parts.

Forced convection is the principal mode of heat transfer.

Key Topics

• Three dimensional assembly
• Incompressible, turbulent, steady state flow
• Automatic Flow Volume creation
• Creation and use of Groups
• Total heat generation boundary condition
• Conjugate and convection heat transfer
• Representing chips with a Compact Thermal Model material
• Modeling printed circuit boards with the PCB Calculator
• Internal Fans and Resistance materials
• Results visualization with cut planes and iso surfaces
• Summary Parts to assess critical values

Goals

• Study the flow and temperature distributions across the system
• Determine the temperature on critical components using Results parts

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