Warpage

When a part cools to room temperature from its elevated cure temperature and is removed from its mold, it will often warp. As discussed in the Model Warpage section of the User's Guide, this problem is compounded when fiber-filled materials are used. You can use the *CURE STRESS keyword in the HIN file to include the effects of thermal residual strains in your structural analysis and predict warpage.

*CURE STRESS

A HIN file is automatically created with the *CURE STRESS keyword when you activate the Output residual strains checkbox during export from Advanced Material Exchange, but you may also create this file manually. When the *CURE STRESS keyword is present in the HIN file, Advanced Material Exchange will use the residual strains from the Moldflow analysis to predict warpage, prior to any externally applied mechanical or thermal loads. Review the Model Warpage section of the User's Guide for more information on how to use these residual strains.