Microchip Encapsulation analysis

The Microchip Encapsulation analysis simulates the encapsulation of semiconductor chips with reactive resins, which provides protection from hostile environments, facilitates heat dissipation, and enables electrical interconnection of the chips.

The reactive nature of the thermosetting encapsulants (typically epoxy molding compounds), and the complex geometries (with molded-in silicon chip paddles, connecting wires and leadframes) pose problems for product design, material selection, tool making, and process control.

Microchip Encapsulation helps solve these problems by providing the tools to design the encapsulation package, tool, leadframe and wires, and to select optimal processing conditions, including mold temperature, filling time, ram-speed profile, and curing time.

Microchip Encapsulation analysis can:

• Simulate the mold filling and curing of the microelectronic device, including the effect of polymer preconditioning within the transfer pot, to predict the impact of processing on the encapsulated device.
• Predict wire sweep, the deformation of the bonding wires within the cavity.
• Predict paddle shift, the shifting of the leadframe due to pressure imbalances.
• Predict part warpage.[1]

[1] To complete a Warp analysis for Midplane or Dual Domain analysis technology, you must select an analysis sequence that includes the Compressible solver