Creating the model and mesh for Microchip Encapsulation

There are compulsory modeling and meshing prerequisites for running a Microchip Encapsulation analysis.

• You must model the wire or leadframe in the same planar (x,y) coordinate system as the chip cavity. However, the z-coordinate value can be arbitrary.
• The z-coordinate should be normal to the cavity.
• The wires and leadframe can be included in the same model.

In addition, consult the following:

Modeling the wire for microchip encapsulation analysis

Modeling for wire sweep detail analysis (3D)

Modeling the paddle for Microchip Encapsulation analysis

Modeling for cross-flow analysis for microchip encapsulation

The illustration below shows an example of a model which has been prepared for Microchip Encapsulation analysis. The illustration shows the pot (a), runner, wire (b), chip cavity (c), and leadframe (d). On the left is a top view. On the right is an angled view.