Solver Enhancements for 2025
The following enhancements to the analysis solvers provide you with better solutions and improved accuracy.
Improved Warpage Accuracy for Dual Domain Analyses
In Dual Domain analyses, multipoint constraints keep the deformation on the top and bottom surfaces consistent. The accuracy of Warp analyses using Dual Domain mesh technology depends on these multipoint constraint equations. In the new release, the multipoint constraint equations have been improved by correcting the interpolation relationship of transverse displacement. This change may bring minor result changes in all Dual Domain Warp cases.
Improved Temperature Calculation for 3D Flow Analyses
The onset of 3D Flow temperature calculation at a node is adjusted in the Moldflow 2025 release to better match the flow front arrival at the node. The impact of this adjustment is most noticeable for models with large thickness variations, where you may see a reduction in potential excessive temperature drop for the calculated temperature. For some models, this change will result in lower predicted injection pressure, and a narrower range of predicted flow front temperatures compared with prior Moldflow releases. In general, the narrower range of predicted flow front temperatures will be in closer agreement with predictions from Midplane and Dual Domain Flow analyses.
Improved Flow Rate Calculation for Midplane and Dual Domain Flow analyses
The Midplane and Dual Domain Flow solver has been enhanced in the Moldflow 2025 release to better simulate the flow rate ramping-up at the start of injection. This enhancement only impacts models with a hot runner volume greater than 25% of the volume to be filled.
Improved accuracy for the Reactive Viscosity model for thermoset materials in 3D analyses
The viscosity value has improved for thermoset materials when the Reactive Viscosity Model is used for the viscosity in 3D analyses. In previous releases, the cure dependence of viscosity was modified from that obtained from the Reactive Viscosity model. Now, the solver uses the cure dependence of the viscosity exactly as given by the Reactive Viscosity model. This viscosity change could affect some results for analyses that use thermoset materials.
Expanded capability of Isolate cause of warpage option to include constraint effect
The Isolate cause of warpage option has been expanded to include the constraint effect for overconstrained parts. In previous releases, the total deflection result was decomposed into deflection from differential shrinkage, differential cooling, orientation effects, and corner effect, without isolating the constraint effect. Now, this effect is also isolated from total deflection and the deflection attributable to other causes.
New results are available for overconstrained parts, including "Deflection, all effects (unconstrained)", "Deflection (large deflection, warp) (unconstrained)", and "Mode shape (unconstrained)", representing the small deflection, large deflection and buckling mode of the part solely with automatically generated constraints that only limit the rigid body motion. This expansion provides a more comprehensive understanding of the factors contributing to part warpage.
Automatic packing is the default option for pack/holding control for some thermoplastics molding processes
Automatic packing is the default option for pack/holding control for some thermoplastics molding processes (such as thermoplastics injection molding and thermoplastics overmolding) in Midplane, Dual Domain, and 3D meshes. With this option, the solver determines the duration and the magnitude of the packing pressure automatically to ensure that packing does not end before the gate is frozen and that a reasonable packing pressure level is used. The automatic packing profile may not necessarily be the optimum profile.