Preparing the model for Reactive Molding analysis

There are modeling tasks required for a Microchip Encapsulation molding analysis, Reactive Molding analysis, and Underfill Encapsulation molding analysis.

Compulsory modeling tasks

In order to run a thermoset analysis, the following must be specified for your model:

• A meshed part model
• Injection location(s).

Analysis setup options

The following can be specified for your model:

• Porosity and permeability for a surface/element (for RTM/SRIM analyses)
• Runner dimension constraints (for a Runner Balance analysis).