*STRR
r1: Stress relaxation or recrystallization temperature
This card is used in conjunction with *STRF inside the material block or blocks to specify the temperature(s) at which stress is relaxed during heat treatment simulation. An *STRR card must be included for each specified material via *MATE and *MATI. For non-homogenous build and build plate materials, plasticity properties must be included in the build plate material block, as also stated by *PPLA.
Required Cards: *STRF, *PPLA
Best practices: For materials with unknown stress relaxation temperatures, use a value between 0.3-0.5 of melting temperature. No stresses will be relaxed if the *STRR value is higher than the peak temperatures specified by the heat treatment in *STRF.