Enable surface-splitting, open the CAD model, and return the surface-splitting option to the default state.
For the subsequent thermal analysis that we will preform on this model, a convection load is applied to the top of the circuit board. In the CAD model, the top of the board is a single surface. That means that the portions of the surface beneath the chip and edge connectors would receive the convection load even though they are not exposed to the ambient air. The solution to this problem is to perform surface-splitting when importing the CAD model.
The surface-splitting operation splits surfaces of CAD parts where they intersect other parts within the assembly. For this model, the single top surface of the circuit board becomes six separate surfaces when surface-splitting is performed. The resultant surfaces are as follows:
By default, surface-splitting in Simulation Mechanical is disabled.
Depending upon whether you constructed the Circuit Board CAD model in SimStudio Tools, choose one of the following two procedures: