Heat is an inevitable by-product of electronic devices. If the device generates too much heat, and the heat is not removed effectively, the components risk failing due to overheating, so a cooling strategy should be employed. Thermal management helps control and dissipate the heat produced by the electronic device. Thermal management of printed circuit board (PCB) components depends on a number of factors including the amount of heat produced, the temperature of the environment, the layout of the components on the board, and the design of the enclosure.
Identify modeled cooling components, such as heat sinks (passive heat exchanger) and fans (forced cooling), and apply appropriate conditions to them. Using the Simplify tools, you can add a heat sink or fan to your Simulation model if they aren't modeled in the original design.
Components within a passive device are cooled by natural convection and conduction. Temperature variations in the air cause density gradients, which in turn cause the air to move. The air movement, conduction, and convection transfer heat from heated components to the surrounding environment.
Using a fan, air enters the enclosure from the environment, passes through the device, and is exhausted to the environment. Heat dissipated by the components is convected away by moving air and conducted through the enclosure.