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Microchip Encapsulation analysis results

This help topic provides an overview of the results generated by a Microchip Encapsulation analysis.

Text based results

The following table lists the text results generated for a Microchip Encapsulation analysis.

Results
Microchip encapsulation analysis log
Results Summary
Analysis Check

Graphical results

The following table lists the graphical results that are created by a Microchip Encapsulation analysis and indicates whether each result is supported for the following analysis technologies:

  • midplane Midplane
  • dual domain Dual Domain
  • 3d 3D

A Microchip Encapsulation analysis generates the filling, curing, and stress results listed in the table below. For more information about a result, including how to interpret the display, click on the result name.

Note: The Microchip Encapsulation results generated will depend on the mesh type, and the wire sweep/paddle shift related solver parameters that you set. Using the advanced solver settings in the Process Settings Wizard, you can select a small deflection or large deflection Stress analysis, and you can select whether the wire sweep/paddle shift simulation should be performed by Autodesk Moldflow Insight Stress or Abaqus.
Tip: To display results of a 3D Wire Sweep analysis effectively, it is important to enable the results visualization option to Display 1D elements as segments. If this option is not enabled, result display could be very slow, especially on models that contain many wires.

Click Application menu, then click Options > Results tab and in the Optimize memory for results display area, click in the Display 1D elements as segments checkbox to enable this option.

Flow (Fill+Pack / filling and curing phase) resultsAnalysis technology
Fill time
Clamp force
Pressure
Flow rate, beams
Average velocity
Orientation at core
Orientation at skin
Shear rate, bulk
Shear stress at wall
Bulk conversion at end of process 1
Bulk temperature at end of fill
Bulk temperature, nodal 1
Cured layer fraction 1
Pressure at end of fill 1
Air traps 2
Pressure at injection location 2
Pressure at V/P switchover 2
Temperature at flow front 2
Volumetric shrinkage 2
Volumetric shrinkage (3D)
% Shot weight 2
Bulk conversion 2
Bulk temperature 2
Frozen layer fraction 2
Grow from 2
Initial stress for warp in first principal direction 2
Initial stress for warp in second principal direction 2
Sink index 2
Throughput 2
Volumetric shrinkage at ejection 2
Weld lines 2
Weld and meld lines 2
Air traps, including air vents 3
Conversion at node
Density
Extension rate
Polymer filled region
Shear rate result (3D)
Shear rate, maximum result
Temperature result (3D)
Unfilled cavity 4
Velocity (3D)
Vent region pressure 3
Viscosity
Pressure difference, maximum (paddle shift) 5
Volume change (Runner balance)
Fiber Orientation analysis results1
Stress / Wire Sweep & Paddle Shift resultsAnalysis technology
Deflection
First principal stress (wire sweep/paddle shift)
Second principal stress (wire sweep/paddle shift)
Max shear stress (wire sweep/paddle shift)
Wire-sweep index 6
Deflection, in-plane (wire sweep) 6
XY deflection (wire sweep) 5
Wire number result 7
Maximum wire deflection magnitude - Wire number: XY Plot result 7
Maximum wire sweep index - Wire number: XY Plot result 7
Wire pairs within critical clearance result 7
Distance to closest wire result 7
Stress in first principal direction (stress)
Stress in second principal direction (stress)
Maximum shear stress (stress)
Stress, Mises-Hencky (stress)
Warp resultsAnalysis technology
Deflection, all effects 2
Note: The Microchip Encapsulation filling and curing and warp results are the same as for Reactive Molding.
1For Midplane and Dual Domain analysis technologies, these results are produced only when you have selected an analysis sequence that includes the Incompressible solver.
2For Midplane and Dual Domain analysis technologies, these results are produced only when you have selected an analysis sequence that includes the Compressible solver.
3This result is available only when the option to Perform venting analysis is selected in the solver parameters.
4This result is only available if a short shot occurs during the analysis.
5This result is only shown when Abaqus is used for the analysis
6In order to calculate this result, the wire sweep calculation must be performed in Autodesk Moldflow Insight.
7In order to calculate this result, the analysis sequence must include Wire Sweep, and the wire sweep calculation must be performed in Autodesk Moldflow Insight.

[1] If you select a material with fiber or filler content, Fiber orientation analysis results also will be generated for a Fill+Pack analysis sequence. The option to perform Fiber orientation analysis if fiber material is enabled by default in the Process Settings Wizard.

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