Process Settings Wizard - Reactive Molding Settings
This page of the Process Settings Wizard, which can be accessed by clicking 
(Home tab > Molding Process Setup panel > Process Settings), is used to specify the reactive molding related process settings for the selected analysis sequence.
| Dialog element | Explanation |
|---|---|
| Melt initial conversion | To specify the level of conversion (curing), enter a value between -1 and 1, where
|
| Curing time | Enter the time, in seconds, that the melt will take to solidify to an acceptable state. |
| %Air mass | Enter a value for air mass when there is a significant amount of air in the resin. For example, the pellet used in the Microchip Encapsulation can have enough air to affect the flow. The %Air mass value accounts for the compressibility of the air in the resin, using the ideal gas law. Because it is in %mass, even a small value can represent a significant volume of air in the resin. In most cases, this value can be set to zero (0). %Air mass is supported for some 3D thermoset processes, such as reactive molding, microchip encapsulation, reactive injection-compression, and reactive compression molding. |
| Preconditioning analysis | Preconditioning data are used to calculate the melt temperature. If you choose to perform preconditioning analysis, click Edit Data to specify the preconditioning data |