Wire-sweep index result
The Wire-sweep index result is a representation of the in-plane force created by the flow of plastic past the wires of an integrated circuit.
The Wire-sweep index result is generated by a Microchip Encapsulation analysis.
A wire-sweep index is calculated and plotted for each wire, as follows:
The analysis finds the point on the wire where displacement in the planar direction is greatest.
Note: With Midplane and Dual Domain analysis technology, the point that has the maximum in-plane displacement of the whole wire is used to calculate the Wire-sweep index value for that wire. With 3D analysis technology, the maximum in-plane deflection of each segment of wire is used to calculate the Wire-sweep index in that segment. For 3D analyses, the Wire-sweep index varies along each wire.It divides the maximum in-plane displacement value by the length of the wire.
The result is the wire-sweep index for the individual wire.
Note: In order to calculate the Wire sweep index result, the wire sweep calculation must be performed in Autodesk Moldflow Insight.
Tip: Edit the Microchip Options Solver parameters by clicking 
(Home tab > Molding Process Setup panel > Process Settings), Profile Settings page, Advanced Options button, Solver parameters area, then click Edit to display the Reactive molding solver parameters dialog. Select the Wire Sweep/Paddle Shift tab. Set the Perform wire sweep/paddle shift simulation in drop-down box to Autodesk Moldflow Insight.
(Home tab > Molding Process Setup panel > Process Settings), Profile Settings page, Advanced Options button, Solver parameters area, then click Edit to display the Reactive molding solver parameters dialog. Select the Wire Sweep/Paddle Shift tab. Set the Perform wire sweep/paddle shift simulation in drop-down box to Autodesk Moldflow Insight.