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Process Settings Wizard - Cooling channel optimization

By using the Process Settings Wizard page, set the cooling channel optimization-related process settings for the selected analysis sequence. To access this dialog, select a Cooling Channel Optimization analysis. Click (Home tab > Molding Process Setup panel > Process Settings), and then click Next to navigate to the Cooling channel optimization Settings page of the Process Settings Wizard.

Dialog ElementExplanation
Relative importance of Cycle Time

If a cooling channel is close to the part, it can extract heat more efficiently. Increasing this value will cause the solution to favor solutions that place cooling channels closer to the part to extract heat faster. This reduces the average temperature of the mold touching the part leading to a reduced cycle time. If the relative importance of Cycle Time is greater than the relative importance of Warpage, average temperature will decrease at the expense of increased part warpage. Part surface temperature variations across the cavity and through the part thickness may increase, resulting in temperature induced part warpage.

Relative importance of Warpage

By reducing the surface temperature variance across the cavity and part thickness, the temperature induced warpage within the part is minimized. The temperature variance is minimized by increasing this value, resulting in less temperature induced warpage within the part. This will require some cooling channels to move away from the part, increasing the average temperature of the cavity and cycle time.

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