Microchip encapsulation molding analysis sequences
The following analysis sequences are available for the microchip encapsulation molding process:
This molding process simulation is available for the following mesh types:
Midplane
Dual Domain
3D
| Analysis sequence | Mesh type |
|---|---|
| Fill (Compressible) | |
| Fill + Pack |  |
| Fill + Pack (Compressible) | |
| Flow (Incompressible) | |
| Fill + Pack + Warp | |
| Fill + Pack + Warp (Compressible) | |
| Fill + Pack + Wire Sweep | |
| Fill + Pack + Wire Sweep (Compressible) | |
| Flow + Wire Sweep (Incompressible) | |
| Fill + Pack + Wire Sweep Detail | |
| Fill + Pack + Paddle Shift | |
| Fill + Pack + Paddle Shift (Compressible) | |
| Flow + Paddle Shift (Incompressible) | |
| Fill + Pack + Dynamic Paddle Shift | |
| Fill + Pack + Paddle Shift + Wire Sweep | |
| Fill + Pack + Wire Sweep + Paddle Shift (Compressible) | |
| Flow + Wire Sweep + Paddle Shift (Incompressible) | |
| Fill + Pack + Dynamic Paddle Shift + Wire Sweep | |
| Runner Balance (Compressible) | |
| Runner Balance (Incompressible) | |
| Cool (FEM) | |
| Cool (FEM) + Fill + Pack | |
| Cool (FEM) + Fill + Pack + Warp | |
| Cool (FEM) + Fill + Pack + Wire Sweep | |
| Cool (FEM) + Fill + Pack + Wire Sweep Detail | |
| Cool (FEM) + Fill + Pack + Paddle Shift | |
| Cool (FEM) + Fill + Pack + Dynamic Paddle Shift | |
| Cool (FEM) + Fill + Pack + Paddle Shift + Wire Sweep | |
| Cool (FEM) + Fill + Pack + Dynamic Paddle Shift + Wire Sweep | |
Note: For 3D mesh types, there is no option to select compressible or incompressible, because the analysis run depends on the pvT data entered.
You can also run a Venting analysis ( only) by selecting the option in the Venting analysis tab of the solver parameters dialog, which can be accessed through the Process Settings Wizard.