Local Simulation changes
This is a selection of issues improved, added, or changed, with the 2025.0 release.
| Key | Note |
|---|---|
| PAN-508 | Users can now specify a repeated dwell during part scale LPBF simulations |
| PAN-142 | The *MSMA card can now be used to perform multi-scale modelling for DED processes |
| PAN-241 | Warnings are now logged for DED meshes with element aspect ratios higher than 4.0, and critical warnings for ratios higher than 10. |
| PAN-526 | The *DCTR card can now be used to optimize inter-pass dwell time |
| PAN-501 | The *TCTR card can now be used to control power in order to achieve a target maximum temperature |
| PAN-505 | The *TCTP card can now be used to control power in order to achieve a target interlayer temperature in part-level models |
| PAN-507 | The *AGPT card can now be used to export ghost parts in order to attain a constant cross-sectional area |
| PAN-509 | distort_stl can now be used to export 3mf files with color for results such as global recoater clearance, as opposed to just the default displacement result |
| PAN-510 | The *CGPT card can now be used to export ghost parts in order to attain a target interlayer temperature |
| PAN-512 | Log messaging has been added for the ghost part iterative solver |
| PAN-514 | Users can now test the effect of their ghost parts on distortion by inserting them into thermo-mechanical simulations. |
| PAN-525 | The *SBC3 card can now be used to add boundary conditions for multi-axis DED in a more general way than *SBBC |
| PAN-531 | Mesh can be coarsened for global-local simulations |
| PAN-513 | PRM files now can record what machine manufacturer they are designed to work with. |