Local Simulation changes
These functions have been improved, added, or changed, with the 2025.1 release.
| Key | Note |
|---|---|
| PAN-546 | Peak thermal gradient results can now be exported using the *ODTP card. |
| PAN-549 | Using *BVOX, a binvox file can now be imported to simulate a volumetric solidity field. |
| PAN-370 | A new result type has been added, STL_ID, to ease visualization of individual parts and support structures after meshing. Use cards *OSID and *OSIF to enable the output. |
| PAN-547 | Structure type output can be enabled for the fine results with the *STYF card, similar to the existing *STYP card. |
| PAN-552 | The *TRUN card can be used to allow truncation of a part by the substrate bounding box. |
| PAN-550 | The --login command-line argument can be used to authorize the solver on Linux using an Autodesk ID. |