In this tutorial, we simulate the flow and heat transfer within an electronics enclosure. This system contains several components, and we model them with Autodesk Simulation CFD material device models such as Compact Thermal Models, Internal Fans, and Distributed Resistance (porous media).
The solid geometry was created in a CAD system. We will create the air volume using the Void Fill geometry tool in Autodesk Simulation CFD.
We will use groups to simplify the process of assigning settings to multiple parts.
Forced convection is the principal mode of heat transfer.
Key Topics
- Three dimensional assembly
- Incompressible, turbulent, steady state flow
- Automatic Flow Volume creation
- Creation and use of Groups
- Total heat generation boundary condition
- Conjugate and convection heat transfer
- Representing chips with a Compact Thermal Model material
- Modeling printed circuit boards with the PCB Calculator
- Internal Fans and Resistance materials
- Results visualization with cut planes and iso surfaces
- Summary Parts to assess critical values
Goals
- Study the flow and temperature distributions across the system
- Determine the temperature on critical components using Results parts