Fusion Simulation studies run in the cloud and rely on cloud computational services. Fusion simulation studies include:
| Study | Simulates |
|---|---|
| Electronics Cooling: | how an electronics model and its internal environment heat up in response to heat loads on PCB components. Shows the temperature of components and the surrounding air and the effect of heat sinks and fans. Add a critical temperature to PCB components to analyze the risk of component failure due to overheating. |
| Static stress: | how the model responds to structural loads and constraints. Shows displacement, stresses, safety factor, reactions, and common failure criteria, based on assumptions of small displacement and linear response to the stress. |
| Nonlinear static stress: | - Large deformation and motion - Changes in contact during the simulated event - Changes in loads or boundary conditions during the simulated event - Nonlinear material behavior (changes in material stiffness and permanent deformation) Multiple calculation increments are performed as the loads are gradually applied (ramped up) |
| Quasi-static Event Simulation: | - Large deformation and motion of single part or multi-body assemblies - Changes in contact during the simulated event, including where the contact conditions can transition from one body to the other - Changes in loads or boundary conditions during the simulated event - Nonlinear material behavior (changes in material stiffness and permanent deformation) Multiple calculation increments are performed as the loads are gradually applied (ramped up) |
| Dynamic Event Simulation: | time-dependent dynamic events, such as impact analysis, where load curves control the magnitude of applied loads and prescribed displacements as a function of time. Event Simulations generally involve very small time increments and short overall event durations. A typical example is simulating the behavior or protective eyewear or helmets during an impact event. |
| Modal Frequencies: | the natural free-vibration characteristics of a part or assembly, while accounting for the effect of structural loads on the natural frequencies. The results give you the shapes of various vibration modes, the corresponding frequencies, and their mass participation factors. |
| Shape optimization: | where you can remove material from your design while still achieving allowable stress and displacement objectives. Optimizes your usage of material, to achieve light weight design goals (such as for aviation equipment). |
| Structural buckling: | the effect of compressive loads on a structure, to determine the critical buckling multiplier for a specified number of buckling mode shapes. A multiplier less than 1.0 means that the structure buckles due to geometric instability before the applied load is reached. |
| Thermal: | heat transfer to determine the steady-state temperature distribution and the resultant heat flow. Note: Because Fusion thermal simulations are steady state, at least one temperature-based thermal load is required in the model to simulate heat transfer. |
| Thermal stress: | temperature-induced stresses due to nonuniform thermal expansion and applied mechanical loads (such as gravity, pressure, or force). The results show you the combined effects of structural load stresses and temperature-induced stresses. |
| Plastic injection molding: | your part filling, to show whether it will have quality issues based on process settings, material selection, and injection locations. From the results you can investigate the Fill, Visual defects, and Warpage. You can also find suggestions on what you could adjust to improve the results. |