Wire sweep analysis

A wire sweep analysis is used to predict the deformation of the bonding wires within the cavity.

A wire sweep analysis is run as part of the microchip encapsulation molding process. It is used to calculate the deformation of the bonding wires (connecting the chip to the leadframe) that occurs during encapsulation. This calculation enables you to improve the mold design and process conditions to prevent wire-sweep from occurring during encapsulation. The wire deformation can be calculated either internally using the Warp module, or externally using Abaqus.

3D Microchip Encapsulation also supports a Wire Sweep Detail analysis, which accounts for the effects of the wires on the fluid flow as well as the effects of the fluid on the wires. The 3D chip cavity model must include the wire cavities as well as the wires themselves. The Wire Sweep Detail analysis takes more time to complete compared to the regular Wire Sweep analysis, but the calculation of deformation can be more accurate.